IC Backend Execution Services

PDK setup through mask submission. We run the backend execution cycle — DRC/LVS closure, multi-corner signoff, foundry coordination, and GDS handoff — for teams that need silicon on schedule.

Shuttle Service

MPW Shuttle Coordination

We manage the full MPW slot lifecycle from process selection through GDS handoff and foundry acceptance. Customers deliver a DRC/LVS-clean netlist or GDSII; we handle PDK provisioning, pre-tapeout checks, slot registration, and mask submission across TSMC, SMIC, GlobalFoundries, and UMC programs.

  • Foundry and process node selection
  • PDK provisioning and DRC deck setup
  • GDS submission and pre-tapeout checks
  • Reticle slot registration and mask coordinates
  • Fabrication tracking and foundry liaison
  • Die delivery and incoming inspection

Typical deliverables: Foundry-accepted GDSII, diced die lot, optional bare-die or packaged delivery, tapeout acceptance confirmation

Foundry Agency

Tape-out Agency

Direct foundry coordination across TSMC, SMIC, GlobalFoundries, UMC, and HLMC. We handle NDA execution, PDK licensing, multi-foundry price comparison, and tapeout data freeze management — reducing coordination overhead for engineering teams without established foundry relationships.

  • Foundry NDA and PDK licensing
  • Multi-foundry quote and lead-time comparison
  • Engineering change and ECO coordination
  • Tapeout deadline and data freeze management
  • IP protection and secure data transfer
  • Wafer procurement and delivery coordination

Typical deliverables: Signed foundry contract, tapeout approval confirmation, wafer lot delivery, OSAT coordination on request

Backend Implementation

IC Physical Implementation

Physical implementation from synthesized netlist to GDSII-ready. We cover multi-corner/multi-mode signoff, PDK compliance, and design-for-yield for the target node. Engagements run under NDA; full ownership of all deliverables returns to the customer on completion.

  • Floorplanning and power grid design
  • Place and route (Cadence Innovus / Synopsys ICC2)
  • Multi-corner, multi-mode timing signoff
  • DRC/LVS closure and antenna rule check
  • Parasitic extraction and SI analysis
  • GDSII generation and tapeout package prep

Typical deliverables: Signoff-clean GDSII, timing/power/SI reports, LVS netlist, DRC-clean layout, foundry submission package

Discuss Scope

Send node, die size, and schedule. Initial response within 48 hours.